heat resistant protection film

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Product description

Parameters

This is a very low-adhesion film used as a secondary material to improve yield in film and foil processing. It has excellent dimensional stability and causes no heat-shrinkage damage to the adherent product even in high-temperature environments. It also has strong chemical resistance.

Excellent dimensional stability in heating processes and a design that minimizes curling.

· No adhesive deposit on the adherent product.

· Silicon-free release film, so there is no risk of contamination.

· Also has excellent chemical resistance and anti-scratch properties.

· Can be easily peeled off after use thanks to its light-peel design.

· Helps prevent wrinkles and folds in processing and improves production yield.

Protective films for preventing film/foil curling, wrinkling and foreign-matter adhesion while undergoing heating.

· Carrier film for printed circuit board and flexible printed circuit board processes

Item

Unit

Normal type	Low adhesive-transfer type
PC-542PA	PC-751	PC-801

Composition	Base material	µm
	Adhesive
	Release film

50	50	50
4	5	10
40	40	38

Release film release force

mN/inch

Adhesive force with polyimide	Unprocessed surface	Initial value	mN/inch
		After heating and pressure loading *a
	Surface processed for high adhesion	Initial value
		After heating and pressure loading *a

120	120	225
180	220	-
120	120	240
240	280	-

Adhesive force with copper foil (shiny side)	Electrolytic copper foil	Initial value	mN/inch
		After heating and pressure loading *a
	Rolled copper foil	Initial value
		After heating and pressure loading *a